文献类型：期刊文献

英文题名：An ultra-thin aluminum flat heat pipe for heat dissipation in aerospace electronic devices

作者：Liang, Yifu[1,2];Yan, Caiman[2];Bai, Jingjing[2];Zhang, Mingkang[1];Zhang, Shiwei[2];Tang, Yong[2];Yuan, Xuepeng[3]

机构：[1]Guangdong Ocean Univ, Sch Mech & Energy Engn, Yangjiang 529500, Peoples R China;[2]South China Univ Technol, Sch Mech & Automot Engn, Intelligent Mfg Engn Lab Funct Struct & Device Gua, Guangzhou 510640, Peoples R China;[3]Huanghuai Univ, Sch Intelligent Mfg, Zhumadian 463000, Peoples R China

年份：2026

卷号：286

外文期刊名：APPLIED THERMAL ENGINEERING

收录：SCI-EXPANDED(收录号：WOS:001638867900006)、、EI(收录号：20255019694651)、Scopus(收录号：2-s2.0-105024306917)、WOS

基金：This work was supported by the National Natural Science Foundation of China (No. 52105444, U22A20194, and 52235011) , the Pearl River Talent Program (2021QN02Z133) , and the Guangdong-Hong Kong Joint Innovation Project of Guangdong Province (2023A0505010001) .

语种：英文

外文关键词：Heat dissipation; Ultra-thin aluminum flat heat pipe; Composite wick; Electronic devices

外文摘要：With the rapid development of satellite power devices towards integration, miniaturization and lightweighting, the heat accumulation in a narrow space has become a bottleneck to further improve their performance. In this work, an ultra-thin aluminum flat heat pipe (UTAFHP) with a thickness of only 1 mm is proposed by utilizing the composite wick. The composite wick consists of multi-layer 2D screen woven mesh and 3D spiral woven mesh. UTAFHPs with the composite wick are experimentally investigated under different filling ratios and inclination angles. The thermal response performance, surface temperature distribution, critical power, thermal resistance, and thermal conductivity of UTAFHPs are carried out, respectively. The results indicate that the optimized filling ratio of UTAFHPs is 30 %, and the recommended working angle is 90 degrees (with gravity assistance). The optimized UTAFHP shows good thermal response performance (35 s to steady state), good temperature distribution, a high critical power (4 W@90 degrees), a low thermal resistance (0.53 degrees C/W @90 degrees), and an excellent thermal conductivity (8928.57 W/(m & sdot;K) @90 degrees). Such UTAFHP with superior heat transfer performance shows great potential in efficient heat dissipation scenario of micro/miniaturized, lightweight satellite power devices in confined spaces.