详细信息
High-performance ceramic vapor chamber with composite wick structures for power device thermal management ( SCI-EXPANDED收录)
文献类型:期刊文献
英文题名:High-performance ceramic vapor chamber with composite wick structures for power device thermal management
作者:Yuan, Xuepeng[1,3];Zhang, Yuhe[2];Li, Guoxin[1];Zhang, Shiwei[3];Tang, Yong[3];Liang, Yifu[4]
机构:[1]Huanghuai Univ, Sch Intelligent Mfg, Zhumadian 463000, Peoples R China;[2]Henan Finance Univ, Sch Educ & Sci, Zhengzhou 450046, Peoples R China;[3]South China Univ Technol, Sch Mech & Automot Engn, Intelligent Mfg Engn Lab Funct Struct & Device Gua, Guangzhou 510640, Peoples R China;[4]Guangdong Ocean Univ, Sch Mech & Energy Engn, Yangjiang 529500, Peoples R China
年份:2027
卷号:231
外文期刊名:INTERNATIONAL JOURNAL OF THERMAL SCIENCES
收录:SCI-EXPANDED(收录号:WOS:001861271200001)、、WOS
基金:This research was supported by Natural Science Foundation of Henan Province (262300421369), Doctoral Research Initiation Grant (501200012462) and National Natural Science Foundation of China (No. 52235011, 52105444, and U22A20194) .
语种:英文
外文关键词:Ceramic vapor chamber; Composite wick; Heat dissipation; Semiconductor power device
外文摘要:Ceramic vapor chambers (CVCs) are considered as an optimal solution to the thermal management challenges of semiconductor power devices. However, the relatively poor heat transfer performance and critical thermal power of CVCs greatly limit their application. In this study, three types of CVCs with grooved wick (GCVC), powdersintered wick (PCVC), and groove-powder composite wick (GPCVC) configurations were fabricated to carry out a systematic comparative investigation. In horizontal state, the critical thermal power and effective thermal conductivity of GCVC, PCVC and GPCVC are 3711.1 W/(m center dot K) @40 W, 5031.4 W/(m center dot K) @50 W, and 7441.2 W/ (m center dot K) @70 W, respectively. The results indicate that the thermal response performance of CVCs is more significantly affected by the amount of liquid filling volume than the structure. PCVC is recommended for low heating power within 40 W, while GCVC is suitable for applications with stringent weight demands and GPCVC is the preferred solution for high heating power up to 70 W. The critical thermal power and effective thermal conductivity of 100% filling rate GPCVC with gravity-assist condition are up to 10158.7 W/(m center dot K) @80 W, which is 423 times that of Al2O3 ceramics. Under natural convection conditions, the optimized GPCVC reduced the heater temperature and temperature difference by 38.8% and 86.0% compared to the same size ceramic plate. The novel GPCVC with high thermal conductivity and temperature uniformity potentially provides a guarantee for heat dissipation of high-power semiconductor power devices in the future.
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