文献类型：期刊文献

中文题名：Preparation of solder pads by selective laser scanning

英文题名：Preparation of solder pads by selective laser scanning

作者：Shi, Wenqing[1,2];Yang, Yongqiang[1];Huang, Yanlu[1];Wei, Guoqiang[1];Guo, Wei[1]

机构：[1]S China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Peoples R China;[2]Guangdong Ocean Univ, Coll Sci, Zhanjiang 524088, Guangdong, Peoples R China

年份：2009

卷号：7

期号：3

起止页码：217

中文期刊名：Chinese Optics Letters

外文期刊名：CHINESE OPTICS LETTERS

收录：SCI-EXPANDED(收录号：WOS:000266970800014)、CSTPCD、、EI(收录号：20092212098295)、Scopus(收录号：2-s2.0-65649149720)、CSCD2011_2012、WOS、CSCD、PubMed

语种：英文

中文关键词：Architectural design;Brazing;Fiber lasers;Laser heating;Laser pulses;Lasers;Lead;Mechanical properties;Photolithography;Pulsed laser applications;Scanning;Welding

外文关键词：Fiber lasers - Copper alloys - Soldering - Laser pulses - Ternary alloys - Silver alloys - Tin alloys

中文摘要：We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows： the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 ram, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.

外文摘要：We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate (CCL). The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it; on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a bears diameter of 0.030 min can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows: the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 mm, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.