文献类型：期刊文献

英文题名：Factors Influencing the Temperature Distribution of 200W Light Emitting Diode Module Used in the Spotlight

作者：Zhou, Jicheng[1];Chen, Xing[1];Zhou, Zhuang[1];Peng, Yinqiao[2];Wang, Yunyun[1];Huang, Jinhui[1]

机构：[1]Cent S Univ, Sch Energy Sci & Engn, Changsha 410083, Hunan, Peoples R China;[2]Guangdong Ocean Univ, Sch Elect & Informat Engn, Zhanjiang, Peoples R China

年份：2018

卷号：39

期号：6

起止页码：493

外文期刊名：HEAT TRANSFER ENGINEERING

收录：SCI-EXPANDED(收录号：WOS:000424194200001)、、EI(收录号：20172703878940)、Scopus(收录号：2-s2.0-85021629492)、WOS

基金：The authors acknowledge the support of the Science and Technology Project of Changsha under contract no. k1403017-11 and Science and Technology Project of Guangdong Province under contract no. 2016A010101028. Also, we would like to thank Qiang Yi and Zhibin Ye for valuable discussions concerning this work.

语种：英文

外文关键词：Fins (heat exchange) - Thermal conductivity - Heat pipes - Light emitting diodes - Temperature distribution - Air

外文摘要：The junction temperature of LED (light emitting diode) has a significant impact on its performance and lifetime. In this paper, a simplified model based on the finite element analysis is developed to simulate the temperature distribution of the 200W LED module using software ANSYS. The model contains LED package, the heat pipe radiator, as well as TIM (thermal interface material) between the LED package and radiator. The temperature distribution of the simulation agrees with that of the experimental measurement. Thickness of TIM affects the heat dissipation significantly, the chips temperature and the maximum temperature difference of chips increases sharply with TIM thickness increasing. Substituting aluminum fins with copper fins cannot improve the heat dissipation performance of heat pipe radiator, and the air velocity of heat pipe radiator plays a key role in the heat dissipation. Thermal conductivity of package submount directly affects the chip temperature and the uniformity of temperature distribution of package submount.