文献类型：会议论文

英文题名：The Cu@SiO2 core-shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis

作者：Du, Jianying[1]; Yang, Wenhu[2,3,4]; Liao, Wei-Hsin[3]; Xiong, Zhengye[2]; Li, Feng[4]; Yu, Shuhui[5]; Sun, Rong[5]

机构：[1] Heyuan Top Strategy Electronics Co., Ltd, Heyuan, China; [2] School of Electronics and Information Engineering, Guangdong Ocean University, Zhanjiang, 524088, China; [3] Department of Mechanical and Automation Engineering, Chinese University of Hong Kong, Shatin, Hong Kong, Hong Kong; [4] Shenzhen Fengyong Technology Co., Ltd, Shenzhen, China; [5] Center for Advanced Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, China

会议论文集：18th International Conference on Electronic Packaging Technology, ICEPT 2017

会议日期：August 16, 2017 - August 19, 2017

会议地点：Harbin, China

语种：英文

外文关键词：Fluorine compounds - Shells (structures) - Core shell nanoparticles - Low-k dielectric - Dielectric properties of solids - Nanocomposite films

外文摘要：In this paper, the Cu@SiO2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15-20 nm SiO2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I-V properties, which indicates that this film can be used for ESD protection circuit. ? 2017 IEEE.