文献类型：期刊文献

英文题名：Investigation on the microstructure evolution and nanocutting mechanism of single-crystal copper under different crystal orientations

作者：Zhang, Ping[1,2];Zhang, Songting[1];Lin, Zhenyong[1];Wang, Shunxiang[1];Yue, Xiujie[2,3];Gao, Yeran[1];Wang, Youqiang[3]

机构：[1]Guangdong Ocean Univ, Coll Mech & Power Engn, Zhanjiang, Peoples R China;[2]Qingdao Huanghai Univ, Coll Intelligent Mfg, Qingdao 266520, Peoples R China;[3]Qingdao Univ Technol, Coll Intelligent Mfg, Qingdao 266520, Peoples R China

年份：2023

卷号：129

期号：1-2

起止页码：815

外文期刊名：INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

收录：SCI-EXPANDED(收录号：WOS:001071711100002)、、EI(收录号：20233914779928)、Scopus(收录号：2-s2.0-85171803485)、WOS

基金：The work was supported by the National Natural Science Foundation of China (51705270), the National Natural Science Foundation of China (No. 51575289), the Natural Science Foundation of Guangdong Province (No. 2023A1515030171), Science and Technology Project of Zhanjiang City, Guangdong Province (No. 2022A01004), the Natural Science Foundation of Shandong Province (No.ZR2016EEP03), the Applied Basic Research Program of Qingdao city (No. 19-6-2-69-cg), and Shandong Qingchuang Science and Technology Project (No. 2019KJB022)

语种：英文

外文关键词：Crystal orientation; Nanocutting; Molecular dynamics; Dislocation density

外文摘要：In order to investigate the microstructure evolution of single-crystal copper (SCC) subjected to nanocutting process under different crystal orientations, SCC with crystal oriented (0 0 1) [0 (1) over bar 0] is rotated around X and Y axes by 30 degrees, 45 degrees, and 60 degrees, respectively. A nanocutting model is built based on large-scale atomic/molecular massively parallel simulator (LAMMPS), and molecular dynamics simulation (MDS) is used to test how the microstructure of SCC changes when subjected to nanocutting process under different crystal orientations, assuming EAM potential between Cu atoms and Morse potential between Cu atoms and the tool. The results show that the crystal orientation indicates a remarkable difference in chip morphology and cutting surface: under crystal orientation of rotating around X-axis, the chips are far wider and thicker than those under crystal orientation of rotating around Z-axis in all cases tested; under crystal orientation of rotating around X-axis, a sudden jump is detected on the cutting surface, whereas no such phenomenon is observed under crystal orientation of rotating around Z-axis. Crystal orientation also makes a marked difference to shear stress and dislocation form: under crystal orientation of rotating around X-axis, the shear stress is higher than that under crystal orientation of rotating around Z-axis; under crystal orientation of rotating around X-axis, the dislocation degree and maximum length of the dislocation line are obviously negatively correlated to the rotation angle. HCP atoms display roughly the same evolution as amorphous atoms; FCC atoms show a completely opposite profile to HCP atoms. The effect of crystal orientation on dislocation density also varies considerably across different types of dislocation.