文献类型：期刊文献

中文题名：基于SSAPSO-PID的白胡椒熟化温度控制系统设计与试验

英文题名：Design and Test of Temperature Control System for White Pepper Curing Based on SSAPSO-PID

作者：俞国燕[1];张嘉伟[1,2];张园[2,3];韦丽娇[2,4];赵振华[2,5];沈德战[2,5]

机构：[1]广东海洋大学机械工程学院,湛江524091;[2]中国热带农业科学院农业机械研究所,湛江524091;[3]广东省农业类颗粒体精量排控工程技术研究中心,湛江524000;[4]湛江市类颗粒体动力学及精准精量排控重点实验室,湛江524091;[5]农业农村部热带作物农业装备重点实验室,湛江524091

年份：2025

卷号：56

期号：5

起止页码：589

中文期刊名：农业机械学报

外文期刊名：Transactions of the Chinese Society for Agricultural Machinery

收录：北大核心2023、、EI(收录号：20252118477991)、北大核心

基金：海南省重点研发计划项目(ZDYF2022XDNY136);湛江市科技计划项目(2022A01032);湛江市科技平台项目(2022A105);中央级公益性科研院所基本科研业务费专项(1630132023005)。

语种：中文

中文关键词：白胡椒初加工生产线;熟化温度;粒子群优化算法;麻雀搜索算法;PID控制

外文关键词：white pepper primary processing line;curing temperature;particle swarm optimization algorithm;sparrow search algorithm;PID control

中文摘要：为解决白胡椒初加工生产线熟化环节长时间无法维持恒温控制、过度依赖人工辅助控温等问题,设计了基于PID的白胡椒初加工生产线熟化温度控制系统。利用STM32和触摸屏控制蒸汽发生器和电调节阀,PT100温度传感器实时监测温度并反馈至系统,通过控制算法调节蒸汽流量以确保稳定控制。采用开环阶跃响应法建立并拟合了熟化机内温度与时间的数学模型,通过Simulink仿真试验对比了Ziegler-Nichols整定法、临界比例度法、衰减曲线法以及基于麻雀搜索算法的粒子群优化自整定法(SSAPSO)性能。最终确定PID最佳控制参数为比例系数K_(p)=0.8759,积分系数K_(i)=0.02,微分系数K_(d)=4.3255。系统试验结果表明,在8 min的熟化过程中,每隔1 min采集当前熟化温度,由于熟化机与空气直接对流换热,其温度稳定在(99±1.5)℃范围内,熟化温度平均相对误差小于1.2%、变异系数小于1.3%,基本实现了熟化过程中自动化精准高效控温的目的。

外文摘要：Aiming to address the challenges of prolonged inability to maintain constant temperature control and excessive reliance on manual assistance in the curing phase of white pepper primary processing production lines,a proportion integration differentiation(PID)-based control system was developed to control the curing temperature of the white pepper during processing.It is a high demand to maintain the constant curing temperature.Specifically,too high curing temperature can lead to the internal physicochemical properties of the destruction,whereas,too low curing temperature can lead to curing not complete,which makes the peeling rate decreased.The control system with an ST Microelectronics 32-bit Microcontroller(STM32)and a touchscreen was utilized to control the start/stop of the steam generator and the opening of the electric regulating valve.A temperature sensor was installed at the outlet of the curing machine,and a PT100 temperature sensor was employed to collect the curing temperature in real-time.Subsequently,the collected data was fed back to the STM32 microcontroller.The PID closed-loop control algorithm was applied to calculate the actuator,adjusting parameters appropriately to ensure stable control of the curing temperature by modulating the steam flow.A systematic analysis of the convective heat exchange process between white pepper and steam at temperature was conducted.A theoretical model of heat transfer was established by using the step response curve method,and the data curve was processed(R^(2)=0.969)to derive the control model for the temperature inside the curing machine over time.Simulation analysis was performed by using the Simulink platform to determine the optimal parameters for PID control.Response curves from four PID parameter tuning methods,including the Ziegler-Nichols method,the decay curve method,the critical proportional method,and the sparrow search algorithm-based particle swarm optimization method(SSAPSO),were compared.Ultimately,it was found that the SSAPSO-based method yielded the best control effect in terms of dynamic performance indicators with PID parameters(proportional coefficient K_(p)=0.8759,integral coefficient K_(i)=0.02,and differential coefficient K_(d)=4.3255).The response time of the PID controller obtained by the SSAPSO-based method was approximately 40 s with an overshoot of about 2.5%.Systematic experimental studies demonstrated that throughout the entire 8 minutes curing process,the current curing temperature was sampled every minute.Due to direct convective heat exchange between the curing machine and the air,the temperature remained stable within the range of(99±1.5)℃.The average relative error of the curing temperature was less than 1.2%,and the coefficient of variation was less than 1.3%,thereby achieving automated,precise,and efficient temperature control during the curing process.