文献类型：期刊文献

英文题名：Xct Images-Based Pore-Scale Numerical Investigation for Heat Transfer Using Copper Foam Filled with Paraffin Phase Change Material

作者：Liu, Xinyu[1]; Zhou, Zhifu[2]; Wu, Wei-Tao[3]; Wei, Lei[4]; Hu, Chengzhi[1]; Lyu, Jizu[5]; Huang, Heng[1]; Li, Yubai[1]; Song, Yongchen[1]

机构：[1] Key Laboratory of Ocean Energy Utilization and Energy Conservation of Ministry of Education, Dalian University of Technology, Dalian, 116024, China; [2] State Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong University, Xi'An, 710049, China; [3] School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing, 210094, China; [4] Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China; [5] School of Mechanical Engineering, Guangdong Ocean University, Zhanjiang, 524088, China

年份：2024

外文期刊名：SSRN

收录：EI(收录号：20240288273)

语种：英文

外文关键词：Computerized tomography - Copper - Heat transfer - Melting - Metal foams - Paraffins - Phase change materials

外文摘要：The principle of phase change heat transfer using copper foam in the paraffin phase change material (PPCM) are not well understood. In this study, based on X-ray computed tomography (XCT), three dimensional (3D) geometric model of copper foam was established, including PPCM domain. We developed a coupled fluid-solid model to explore phase change for heat transfer in the composite phase change material (CPCM) with copper foam and PPCM. The effects of phase change melting behavior, heat transfer characteristics and homogeneity of temperature were considered. Results of numerical simulation demonstrated that the CPCM had completely melted at 669.8 s. Here the melting time decreased by 45%, compared with the pure PPCM at 1218 s. The extensive heat transfer contact area was offered by the copper foam skeleton. Meanwhile, the melting durations of the CPCM ranged from 4368 s, 2236.3 s, 509.4 s, and 284.6 s corresponding to the heat fluxes with 500 W/m2, 1000 W/m2, 5000 W/m2, and 10000 W/m2. The melting process correlated directly with the heat flux, making it adaptable to the operational demands of diverse electronic components. ? 2024, The Authors. All rights reserved.