文献类型：会议论文

英文题名：The Cu@SiO₂ Core-Shell nanoparticles filled polyvinylidene fluoride nanocomposites film: Fabrication, characterization and dielectric property analysis

作者：Du, Jianying[1];Yang, Wenhu[2,3];Liao, Wei-Hsin[3];Xiong, Zhengye[2];Li, Feng[4];Yu, Shuhui[5];Sun, Rong[5]

机构：[1]Heyuan Top Strategy Elect Co Ltd, Heyuan, Peoples R China;[2]Guangdong Ocean Univ, Sch Elect & Informat Engn, Zhanjiang 524088, Peoples R China;[3]Chinese Univ Hong Kong, Dept Mech & Automat Engn, Shatin, Hong Kong, Peoples R China;[4]Shenzhen Fengyong Technol Co Ltd, Shenzhen, Peoples R China;[5]Chinese Acad Sci, Shenzhen Inst Adv Technol, Ctr Adv Mat, Shenzhen 518055, Peoples R China

会议论文集：18th International Conference on Electronic Packaging Technology (ICEPT)

会议日期：AUG 16-19, 2017

会议地点：IEEE, Harbin, PEOPLES R CHINA

主办单位：IEEE

语种：英文

外文关键词：PVDF composite; Embedded capacitor; Dielectric constant; CU@SiO2

外文摘要：In this paper, the Cu@SiO2 core-shell particles were synthesized using a simple method and well characterized with XRD and SEM techniques. The results of TEM show that a thickness of 15-20 nm SiO2 shell were uniformly coated on the surface of copper particles. The dielectric properties of the PVDF composites filled with Cu@SiO2 particles were measured and analyzed. The results show that the dielectric constant of PVDF flexible composites film increases with increasing filler content. Moreover, the 19vol% composite film presents obvious nonlinear I-V properties, which indicates that this film can be used for ESD protection circuit.