文献类型：期刊文献

英文题名：Interface Matching and Phase-Transformation Nucleation During Laser Fabrication of Pb-free Solder Bumps

作者：Huang, J.[1];Shi, W-Q[1];Xie, Y-P[1];Li, Y-Q[1];An, F-J[2]

机构：[1]Guangdong Ocean Univ, Coll Elect & Informat Engn, Zhanjiang 524088, Guangdong, Peoples R China;[2]Guangdong Ocean Univ, Sch Mech & Power Engn, Zhanjiang 524088, Guangdong, Peoples R China

年份：2020

卷号：47

期号：4-6

起止页码：195

外文期刊名：LASERS IN ENGINEERING

收录：SCI-EXPANDED(收录号：WOS:000564977700001)、、EI(收录号：20213210724376)、Scopus(收录号：2-s2.0-85111740403)、WOS

语种：英文

外文关键词：Fibre laser; copper clad laminate (CCL); laser soldering; Pb-free soldering; filler metal bump

外文摘要：Sn-Ag3.5-Cu0.7 Pb-free solder bumps were successfully fabricated on a copper clad laminate (CCL) surface by using a fiber laser system. The parameters of the laser apparatus used in the fabrication were laser power of 12 W, pulse frequency of 500 kHz, pulse duty factor of 50% and spot diameter of 0.03 mm The fabrication result shows that the solder bumps formed by laser soldering were sufficiently and uniformly melted and securely joined with good properties. In this study, the spherical cap-type appearance of the solder bumps was theoretically interpreted from the perspective of the degree of lattice interface matching and it was demonstrated by non-spontaneous metal nucleation theory that the experimental parameters had been reasonably selected.